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Rutronik Info

Rutronik introduces MLCCs from KEMET using KONNEKTTM technology, offering a unique composition with special conductivity

KEMET's KONNEKTTM technology enables the connection of multiple MLCCs to a single surface-mountable component, reducing equivalent series resistance, equivalent series inductance, and thermal resistance of capacitors without a metal frame.

Congatec News

Congatec COM Express modules receive IEC-60068 railway certification

This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations.

Mediatek News

MEDIATEK SUCCESSFULLY DEVELOPS FIRST CHIP USING TSMC'S 3NM PROCESS

MediaTek and TSMC are taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

Impulse Embedded News

Nuvo-9166GC from Impulse Embedded

A Cutting-Edge AI Inference PC for Intelligent Processing.

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