05
'24
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ASUS News
05
'24
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Intel News
COMPUTEX: INTEL ACCELERATES AI EVERYWHERE, REDEFINES POWER, PERFORMANCE AND AFFORDABILITY
With Intel Xeon 6 processors, Gaudi accelerators and Lunar Lake architecture, Intel delivers the best of AI across cloud, networking, client and edge solutions.
05
'24
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TDK News
TDK INTRODUCES NEW STRAY-FIELD ROBUST 3D-MAGNETIC POSITION SENSOR
HAL/HAR 3936-4100 is a high-precision, stray-field robust Hall-effect 3D-position sensor with low-power functions.
05
'24
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Nvidia News
COMPUTER INDUSTRY JOINS NVIDIA FOR THE NEXT INDUSTRIAL REVOLUTION
Top Computer Manufacturers Unveil Array of Blackwell-Powered Systems Featuring Grace CPUs, NVIDIA Networking and Infrastructure.
04
'24
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Fraunhofer News
Fraunhofer consortium presents one-stop store for micromechanical ultrasound
The institutes Fraunhofer ISIT, IPMS and ENAS are presenting a pioneering initiative to promote MEMS-based ultrasonic sensor technology at SENSOR+TEST in Nuremberg, Germany.
04
'24
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Qualcomm News
Qualcomm Computex 2024 Keynote Unveils “The PC Reborn” with Snapdragon X Series and Copilot+ PCs
Unparalleled performance per watt and on-device AI experiences with the world’s fastest and most efficient NPU for laptops.
04
'24
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ASUS News
ASUS Presents ESC AI POD With NVIDIA GB200 NVL72 at Computex 2024
Showcase includes comprehensive server lineup powered by latest NVIDIA MGX and HGX platforms, elevating enterprise AI to new heights.
04
'24
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Infineon News
New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.
04
'24
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Rutronik Info
Rutronik introduces HVSL800 connectors from Amphenol IPG
Fulfils the requirements of LV215 for electric vehicle applications.
04
'24
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NXP News
