Softing Industrial Automation announces the release of the latest version V5.35 of dataFEED OPC Suite which offers comprehensive support for SINUMERIK 840D CNC machines as well as the integration of web services.
As the automotive industry transitions to software-defined vehicles and new E/E architectures, the demand for high-performance hardware and robust cybersecurity solutions increases.
Vishay Intertechnology has introduced a new Automotive Grade IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A.
Thanks to an adjustable sound cone and small dead zone, the new Leuze ultrasonic sensors of the 420B and 412B series can be used for many different applications.
Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.
Innodisk announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable length limitations, allowing embedded camera modules to be positioned farther from the system.
CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.