16
'25
Written on
e-con Systems News
16
'25
Written on
IDS Imaging Development Systems GmbH
IDS integrates Sony IMX900 into uEye low-cost models
The 2.25 µm miniature pixels of the compact global shutter sensor with a resolution of 3.2 MP (2048 x 1536 pixels) deliver brilliant results, even with fast-moving objects.
16
'25
Written on
ASRockInd News
ASRock Launches Edge AI Platform for Industrial Applications
ASRock’s Jetson AGX Orin Developer Kit delivers 275 TOPS AI power, multi-camera integration, and rugged design for robotics and edge AI deployments.
15
'25
Written on
Advantech News
BitFlow and Advantech Facilitate Next Generation of Autonomous Mobile Robots
BitFlow CoaXPress frame grabbers are compatible with Advantech Edge AI Inference Boxes to bring Vision AI in AMRs.
14
'25
Written on
Microchip News
Microchip Expands Space-Grade FPGA Line with New RT PolarFire Updates
Microchip's RT PolarFire FPGA gains MIL-STD-883/QML-Q certification; new SoC sample adds RISC-V core, enhanced SEL protection, and lower power use.
14
'25
Written on
LAPP UK
LAPP Group is Expanding in Latin America
Acquisition in Brazil as LAPP Takes over EUROCABOS.
14
'25
Written on
Direct Insight News
Direct Insight Launches QSMP-25 Module with STM32MPU for Secure Edge AI in Industry 4.0
29mm² QFN solder-down SoM combines dual ARM Cortex-A35, NPU, GPU, PCIe, and Linux for advanced multimedia and AI edge processing.
14
'25
Written on
Rohm Semiconductors News
ROHM Releases New Level 3 SPICE Models with Faster Simulation Speed
New L3 models for 4th Gen SiC MOSFETs cut simulation time by ~50%, boosting design efficiency and accuracy.
14
'25
Written on
STMicroelectronics News
STMicroelectronics and Metalenz Expand Metasurface Optics Collaboration
STMicroelectronics extends Metalenz IP to produce metasurface optics in its 300mm fab for biometrics, LiDAR, and 3D sensing, shifting optics production to semiconductor manufacturing.
11
'25
Written on
Bender News
