The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.
Innolux presents next-generation display technologies integrating MicroLED and naked-eye 3D to support retail, cockpit, and smart device applications at CES 2026.
Integrated signal-processing architecture adopted to accelerate millimeter-wave imaging for security screening, reducing data load and enabling near real-time analysis.
MediaTek and DENSO partner to develop power-efficient AI chips for advanced driver-assistance systems, enhancing safety and performance for next-generation automotive cockpit technologies.
Samsung Semiconductor outlines its strategy to lower greenhouse gas emissions in semiconductor manufacturing through collaboration on alternative gases and process improvements.
Kyocera Corporation has developed a sub-millimetre meta-lens that shifts focal position by wavelength, supporting compact optical systems and a wearable aerial display prototype.
Keysight signs a five-year agreement with leading Singapore research institutions to advance qubit design, control, and scalable quantum processor architectures.