Building upon its proven expertise in serial EEPROM technology, STMicroelectronics has introduced the market’s first Serial Page EEPROM. This brand-new class of EEPROM is a high-density, page-erasable SPI memory that delivers unique and unprecedented flexibility and performance with ultra-low power consumption.
New class of processors with critical deterministic behavior of safe MCUs, but with unparalleled combination of gigahertz speed, multi-application isolation and memory expansion capabilities. Ideal for safe integration of cross-domain vehicle functions for software-defined vehicles.
TDK Corporation has introduced a thin pattern coil to support the wireless charging of next generation mobile devices. Industry-leading 0.76 ㎜ thickness achieved via unique pattern coil technology.
Nexperia, the expert in essential semiconductors, today announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next generation low voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards.
At embedded world 2022, Congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.
4x-785C PXI & PXIe range increases performance, minimizes space and cost Debuting at International Microwave Symposium (IMS), Booth 11006, Colorado Convention Center 19-24 June 2022, Denver.