The exhibition will focus on Samsung’s advanced technologies, highlighting how they are driving new possibilities in diverse applications including HPC, server, data center, automotive and consumer electronics.
Nexperia has introduced a new series of high-performance gate driver ICs, designed to drive N-channel MOSFETs in synchronous buck or half-bridge configurations, enhancing efficiency and robustness in applications.
Exxelia will be present at the Electronica 2024 show in Munich on booth A5/319, and at the same time announces the launch of its new website, designed to offer an improved user experience.
This integration empowers developers to achieve real-time, high-fidelity, physically accurate simulations that dramatically enhance the development, testing, and deployment of advanced robotic solutions.
The X5M007E120 offers ultra-low resistance, enhanced reliability, and energy efficiency for electric vehicles, enabling custom solutions with its bare die format and innovative Schottky diode integration.
The industry-first adaptive SoC features CXL 3.1, PCIe Gen6, and LPDDR5X support, delivering faster data movement, enhanced memory utilization, and secure connectivity for data-intensive applications.
TDK Corporation further extends its InvenSense SmartAutomotive™ MEMS sensor family with the IAM-20685HP and IAM-20689 second generation 6-axis IMUs for automotive safety applications.
The industry’s first E3.S 60TB SSD, the Micron ION 6550 delivers best-in-class energy efficiency at up to 67% more density per rack for exascale data centers.