29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

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Aaronn Electronic GmbH news

Scalable ARM Performance in a COM-HPC Mini Module

Aaronn Electronic introduces the congatec conga-HPC/mIQ-X, a COM-HPC Mini module designed for edge AI, machine vision, and industrial automation applications.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

Mersen News

Electrical Protection Technologies for Renewable Energy Systems

Mersen showcases integrated surge protection, fuse technologies, and power management solutions for solar, energy storage, and EV charging infrastructure.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

TDK News

3D Hall-Effect Sensor for Automotive Motion Control

TDK introduces the HAL 13xy sensor family for speed and direction detection in automotive and industrial systems.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Integrating semiconductor electronic design automation software for advanced process technologies

Siemens and Samsung Foundry cooperate to qualify digital infrastructure for next-generation semiconductor manufacturing nodes.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Launches Web-Based Power Electronics Simulation Tool

A browser-based platform for rapid loss and thermal analysis helps engineers evaluate power semiconductor choices before hardware prototyping.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

Automotive USB Type-C Charging Controller for 140W Power Delivery

Diodes Incorporated combines USB PD3.1 source control and synchronous buck regulation to reduce component count in vehicle charging architectures.

Read more…

29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-29T00:00:00+00:00" | date "longDate" }}

Infineon News

Contactless Payment Tokenization Integration for Active Smart Wearables

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-28T00:00:00+00:00" | date "longDate" }}

Kontron News

3U VPX AI Computing for Defense Systems

Kontron introduces a ruggedized 3U VPX computing platform combining CPU, GPU, and AI acceleration for embedded defense and aerospace workloads.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-28T00:00:00+00:00" | date "longDate" }}

Toshiba News

High-Speed Quad-Channel Digital Isolators Expand Industrial Signal Protection

Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-28T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Vehicle Power Distribution Systems Target Off-Highway Electrification

Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.

Read more…

Technical Articles

Vertical Transistor Integration Through Stacked Nanosheet Architecture

Case studies

IDS multi-camera imaging reveals the 3D structure of highly dynamic plasma jets

Scalable ARM Performance in a COM-HPC Mini Module

Aaronn Electronic introduces the congatec conga-HPC/mIQ-X, a COM-HPC Mini module designed for edge AI, machine vision, and industrial automation applications.

Electrical Protection Technologies for Renewable Energy Systems

Mersen showcases integrated surge protection, fuse technologies, and power management solutions for solar, energy storage, and EV charging infrastructure.

3D Hall-Effect Sensor for Automotive Motion Control

TDK introduces the HAL 13xy sensor family for speed and direction detection in automotive and industrial systems.

Integrating semiconductor electronic design automation software for advanced process technologies

Siemens and Samsung Foundry cooperate to qualify digital infrastructure for next-generation semiconductor manufacturing nodes.

ROHM Launches Web-Based Power Electronics Simulation Tool

A browser-based platform for rapid loss and thermal analysis helps engineers evaluate power semiconductor choices before hardware prototyping.

Automotive USB Type-C Charging Controller for 140W Power Delivery

Diodes Incorporated combines USB PD3.1 source control and synchronous buck regulation to reduce component count in vehicle charging architectures.

Contactless Payment Tokenization Integration for Active Smart Wearables

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

3U VPX AI Computing for Defense Systems

Kontron introduces a ruggedized 3U VPX computing platform combining CPU, GPU, and AI acceleration for embedded defense and aerospace workloads.

High-Speed Quad-Channel Digital Isolators Expand Industrial Signal Protection

Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.

Vehicle Power Distribution Systems Target Off-Highway Electrification

Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.

International