08
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innodisk
07
'26
Written on
SK Hynix News
SK hynix Unveils Next-Generation AI Memory at CES 2026
From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.
07
'26
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Qualcomm News
Snapdragon X2 Plus Platform for Windows PCs
Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.
07
'26
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Thales Group News
Post-Quantum Security Chip Advances Embedded Cryptography
Thales collaborates with Samsung Electronics to supply quantum-resistant cryptographic software for a security chip showcased at the CES 2026 technology exhibition in Las Vegas.
07
'26
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Digi-Key News
High-Speed Video Links Drive Vision System Performance
Manufacturers deploy Gigabit Multimedia Serial Link technology to support high-bandwidth, low-latency video and sensor data across automotive and industrial sectors.
07
'26
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Seco News
COM Express module brings Intel Core Ultra Series 3 to the edge
SECO introduces a new COM Express Type 6 module based on Intel Core Ultra Series 3 processors, targeting AI-driven industrial and embedded edge systems.
07
'26
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STMicroelectronics News
STM32MP21 targets cost-efficient, secure edge computing
STMicroelectronics expands the STM32MP2 series with the STM32MP21 MPUs, combining low power consumption, flexible performance, and a security architecture aligned with industrial and IoT requirements.
07
'26
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ADLINK News
COM Express module targets high-performance edge AI
ADLINK Technology Inc. introduces the Express-PTL COM Express module based on Intel Core Ultra Series 3 processors to support demanding edge AI and embedded applications.
07
'26
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Micron News
Micron Launches World's First Gen5 G9 QLC SSD for Client Computing
The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.
06
'26
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Congatec News
