07 {{ "2024-03-07T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-07T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMICROELECTRONICS REVEALS HIGH-PERFORMANCE, STATE-OF-THE-ART WIRELESS MICROCONTROLLERS

Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology Inrush Current Limiting PTC Thermistors Increase Performance in Active Charge and Discharge Circuits

For Automotive and Industrial Applications, Self-Protecting Devices Combine R25 Values to 1 kΩ With High Voltages to 1200 VDC and Energy Handling to 240 J.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

IMD Technologies

IMDT LAUNCHES NEW SOM AND SBC WITH THE LATEST RENESAS RZ/V2H SOC FOR HIGH-PERFORMANCE ROBOTIC APPLICATIONS WITH VISION-AI AND REAL-TIME CONTROL

The V2H-based SOM (system-on-module) and SBC (single-board-computer) boast a Quad Cortex^®-A55 (1.8GHz) CPU and an integrated AI accelerator, DRP-AI3, optimized for a range of AI-driven vision applications.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS is the first industrial camera manufacturer to offer the Sony sensor IMX662 in both colour and mono

The new uEye+ XCP and XLS cameras perform particularly well in low-light applications.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz at EMV 2024: Outstanding T&M solutions from the market leader in EMC

At the EMV show 2024 in Cologne, Rohde & Schwarz showcases a comprehensive range of EMC test and measurement solutions – ranging from standalone instruments and software to application-specific systems. The company dedicates a large part of the booth to demonstrations that show EMI compliance testing, EMC test automation, EMS immunity test, EMI debugging and EMF. The Rohde & Schwarz solutions are on display from March 12 to 14, 2024 at the Cologne exhibition center, hall 11.1, booth 106.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces CoolSiC™ MOSFET G2, the next generation of silicon carbide technology for high-performance systems that drive decarbonization

Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.

Read more…

06 {{ "2024-03-06T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-06T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG DEVELOPS INDUSTRY-FIRST 36GB HBM3E 12H DRAM

HBM3E 12H achieves industry’s largest capacity HBM with groundbreaking 12-layer stack, raising both performance and capacity by more than 50%.

Read more…

05 {{ "2024-03-05T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-05T00:00:00+00:00" | date "longDate" }}

MIkroe News

Shield enables Click boards to be added to Red Pitaya ‘Swiss Army Penknife’ engineering platform

MIKROE unlocks even more possibilities for engineering and programming projects.

Read more…

05 {{ "2024-03-05T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-05T00:00:00+00:00" | date "longDate" }}

Qualcomm News

QUALCOMM UNVEILS THE WORLD’S MOST ADVANCED 5G MODEM-RF SYSTEM

The Snapdragon X80 5G Modem-RF System fuses artificial intelligence with unparalleled spectrum flexibility, power efficiency, and performance.

Read more…

04 {{ "2024-03-04T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-04T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon enhances the TRAVEO™ T2G MCU family with Qt Group graphics solution to enable intelligent rendering technologies

In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

STMICROELECTRONICS REVEALS HIGH-PERFORMANCE, STATE-OF-THE-ART WIRELESS MICROCONTROLLERS

Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices.

Vishay Intertechnology Inrush Current Limiting PTC Thermistors Increase Performance in Active Charge and Discharge Circuits

For Automotive and Industrial Applications, Self-Protecting Devices Combine R25 Values to 1 kΩ With High Voltages to 1200 VDC and Energy Handling to 240 J.

IMDT LAUNCHES NEW SOM AND SBC WITH THE LATEST RENESAS RZ/V2H SOC FOR HIGH-PERFORMANCE ROBOTIC APPLICATIONS WITH VISION-AI AND REAL-TIME CONTROL

The V2H-based SOM (system-on-module) and SBC (single-board-computer) boast a Quad Cortex^®-A55 (1.8GHz) CPU and an integrated AI accelerator, DRP-AI3, optimized for a range of AI-driven vision applications.

IDS is the first industrial camera manufacturer to offer the Sony sensor IMX662 in both colour and mono

The new uEye+ XCP and XLS cameras perform particularly well in low-light applications.

Rohde & Schwarz at EMV 2024: Outstanding T&M solutions from the market leader in EMC

Infineon introduces CoolSiC™ MOSFET G2, the next generation of silicon carbide technology for high-performance systems that drive decarbonization

Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.

SAMSUNG DEVELOPS INDUSTRY-FIRST 36GB HBM3E 12H DRAM

HBM3E 12H achieves industry’s largest capacity HBM with groundbreaking 12-layer stack, raising both performance and capacity by more than 50%.

Shield enables Click boards to be added to Red Pitaya ‘Swiss Army Penknife’ engineering platform

MIKROE unlocks even more possibilities for engineering and programming projects.

QUALCOMM UNVEILS THE WORLD’S MOST ADVANCED 5G MODEM-RF SYSTEM

The Snapdragon X80 5G Modem-RF System fuses artificial intelligence with unparalleled spectrum flexibility, power efficiency, and performance.

Infineon enhances the TRAVEO™ T2G MCU family with Qt Group graphics solution to enable intelligent rendering technologies

In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing.

International

Technical Articles

Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices.

For Automotive and Industrial Applications, Self-Protecting Devices Combine R25 Values to 1 kΩ With High Voltages to 1200 VDC and Energy Handling to 240 J.

The V2H-based SOM (system-on-module) and SBC (single-board-computer) boast a Quad Cortex®-A55 (1.8GHz) CPU and an integrated AI accelerator, DRP-AI3, optimized for a range of AI-driven vision applications.

The new uEye+ XCP and XLS cameras perform particularly well in low-light applications.

Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.

HBM3E 12H achieves industry’s largest capacity HBM with groundbreaking 12-layer stack, raising both performance and capacity by more than 50%.

MIKROE unlocks even more possibilities for engineering and programming projects.

The Snapdragon X80 5G Modem-RF System fuses artificial intelligence with unparalleled spectrum flexibility, power efficiency, and performance.

In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing.

International

The V2H-based SOM (system-on-module) and SBC (single-board-computer) boast a Quad Cortex^®-A55 (1.8GHz) CPU and an integrated AI accelerator, DRP-AI3, optimized for a range of AI-driven vision applications.