Technical Articles

What You Should Know About RFID Tags

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

White Paper

Maximize Your Power System Efficiency

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LAPP UK

LAPP Group is Expanding in Latin America

Acquisition in Brazil as LAPP Takes over EUROCABOS.

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14 {{ "2025-07-14T00:00:00+00:00" | date "MMM" }} '25

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Direct Insight News

Direct Insight Launches QSMP-25 Module with STM32MPU for Secure Edge AI in Industry 4.0

29mm² QFN solder-down SoM combines dual ARM Cortex-A35, NPU, GPU, PCIe, and Linux for advanced multimedia and AI edge processing.

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Rohm Semiconductors News

ROHM Releases New Level 3 SPICE Models with Faster Simulation Speed

New L3 models for 4th Gen SiC MOSFETs cut simulation time by ~50%, boosting design efficiency and accuracy.

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14 {{ "2025-07-14T00:00:00+00:00" | date "MMM" }} '25

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STMicroelectronics News

STMicroelectronics and Metalenz Expand Metasurface Optics Collaboration

STMicroelectronics extends Metalenz IP to produce metasurface optics in its 300mm fab for biometrics, LiDAR, and 3D sensing, shifting optics production to semiconductor manufacturing.

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11 {{ "2025-07-11T00:00:00+00:00" | date "MMM" }} '25

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Bender News

Bender Charge Controllers Meet EU’s New AFIR ISO 15118 Requirements

Bender charge controllers with PLC fully support ISO 15118 standards, ensuring compliance with upcoming AFIR mandates for AC charging infrastructure.

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11 {{ "2025-07-11T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon Launches Secure System-in-Package for USB Tokens

Infineon’s ID Key S USB combines a secure SLC38 controller and USB bridge in a certified system-in-package for robust hardware-based authentication and encryption.

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11 {{ "2025-07-11T00:00:00+00:00" | date "MMM" }} '25

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Nexperia News

Nexperia Boosts Portfolio with 1200V SiC Schottky Diodes

Nexperia expands its wide-bandgap portfolio with new 1200V 20A SiC Schottky diodes, offering ultra-low power loss for high-efficiency industrial applications like AI server infrastructure.

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11 {{ "2025-07-11T00:00:00+00:00" | date "MMM" }} '25

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MURATA News

Murata Launches World’s First 47μF MLCC in 0402-inch Size

New ultra-compact capacitors deliver 60% space savings and high-temperature reliability for AI servers, data centers, and next-gen electronics.

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11 {{ "2025-07-11T00:00:00+00:00" | date "MMM" }} '25

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Anritsu News

Anritsu Validates 3GPP Rel-17 NR NTN Test Cases for 5G Satellite Connectivity

ME7834NR platform enables conformance testing for NR NTN, expanding 5G coverage through satellite networks.

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10 {{ "2025-07-10T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon Launches 3rd Gen High-Precision 3D Sensor

Infineon’s XENSIV 3D magnetic Hall sensors offer ASIL-B support, ±160 mT range, and low power for high-precision positioning across multiple industries.

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