Highlights include new generation projection-capable headlamps for automobiles, upgraded UV-C LEDs for disinfection and various sensor solutions and intelligent image recognition systems for enhanced efficiency and safety.
Toshiba Electronics Europe GmbH has partnered with MIKROE to integrate its Smart Motor Control Driver IC into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive applications.
Anritsu Corporation is proud to announce full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.
This technological breakthrough is part of the Military GPS User Equipment Increment 2 Miniature Serial Interface (MSI) program, the result of a $247 million contract received in 2020 from U.S. Space Force Space Systems Command.
E.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 and ARM, offers the highest AI performance in the smallest space with the PROFIVE® NUCU series.
ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).
This collaboration equips Vecow's high-performance edge AI systems with remote management functionalities, levering Allxon's Out-of-Band (OOB) solutions to redefine efficiency and security across industries.