Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility
A switch must always be affordable and easy to install if high port density is required in extended industrial centres. Robust design for the highest possible permissible ambient temperatures during operation is a further factor in favour of enabling rail mounting and the installation of several switches in switch boxes.
TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types.
ROHM CO., LTD. and ROHM Wako CO., LTD. have announced to build a new production facility at its manufacturing subsidiary in Malaysia, ROHM-Wako Electronics (Malaysia) Sdn. Bhd. (RWEM) to increase production capacity of analog LSIs and transistors due to growing demands.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its third generation of STPOWER silicon-carbide (SiC) MOSFETs1, advancing the state-of-the-art in power devices for electric-vehicle (EV) powertrains and other applications where power density, energy efficiency, and reliability are important target criteria.