Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TB9120AFTG,” a constant-current 2-phase stepping motor driver for automotive applications. The new IC outputs a sine-wave current using only a simple clock input interface, with no need for an advanced functional MCU or dedicated software.
binder, one of the industry and technology leaders in the field of industrial circular connectors, has expanded its Harsh Environment Connector (HEC) series 696 with some important models. The previous product range is supplemented by flange and cable variants with built-in protective conduit adaptation.