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NXP News

NXP Advances IoT Connectivity with Industry’s First Secure Tri-Radio Device

NXP® Semiconductors (NASDAQ: NXPI) today announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases, and supports the new groundbreaking Matter connectivity protocol.

CEVA News

CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More

Consumer Electronics Show -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, has announced that it has enhanced the software offerings and tool kits for its highly successful Bluebud wireless audio platform with the addition of Bluebud-HD, a pre-configured software package that includes all the audio, voice and context-aware software required in premium TWS earbuds, gaming headsets, hearables, wearables and other smart audio products.

Infineon News

Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset

The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.

Congatec News

CONGATEC LAUNCHES 10 NEW COM-HPC AND COM EXPRESS COMPUTER-ON-MODULES WITH 12TH GEN INTEL CORE PROCESSORS

Congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems.

Intel News

CES 2022: INTEL ACHIEVES MAJOR MILESTONES ACROSS AUTOMOTIVE, PCS AND GRAPHICS

Mobileye announces the new EyeQ® Ultra system-on-chip for autonomous vehicles and expanded relationships with major automakers, including Ford, Volkswagen Group and Geely’s ZEEKR brand. Intel launches the 12th Gen Intel® Core i9-12900HK – the world’s best gaming laptop platform1 – and delivers the new P-series product line for ultra-portable, enthusiast-class performance. Intel ships high-performance discrete graphics to customers and announces more than 50 Alchemist design wins.

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