15
'25
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AMD News
15
'25
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Fraunhofer News
New Tool for Next-Generation Microdisplays
Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.
15
'25
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Broadcom News
Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era
New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.
15
'25
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STMicroelectronics News
STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories
Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.
15
'25
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Power Integrations News
Power Integrations Unveils 1250 V and 1700 V PowiGaN for 800 VDC AI Data Centers
The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.
14
'25
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Microchip News
Microchip Unveils 3 nm PCIe Gen 6 Switch
PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.
14
'25
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Nvidia News
NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer
The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.
14
'25
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Renesas News
Renesas Enables 800V DC Power Architecture for Next-Generation AI Data Centers
Renesas’ GaN-based converters achieve up to 98% efficiency, supporting scalable 48V–800V DC architectures to meet growing AI data center power demands.
14
'25
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TDK News
TDK to showcase ultra-low-power sensing and processing solution powered by Renesas
The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.
13
'25
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Allied Market Research
