Siemens announced a significant update to its industrial-grade private 5G infrastructure solution, that will enable manufacturers to cover larger industrial areas with enhanced connectivity capabilities.
Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment.
Demonstrations will include emulation and test solutions for electrical and optical transmissions and data center interconnect applications up to speeds of 800G and 1.6T as well as design and simulation of chiplet interconnects.
This enhancement delivers up to 2x boost in generative AI inference performance, reinforcing powerful applications in computer vision, robotics, and local AI deployment.