The upcoming DeviceEdge AIE-KT and new fanless AIE-PT systems will support NVIDIA Jetson T3000 and T2000 modules, enabling scalable, power-efficient AI computing for robotics and industrial edge applications.
Microchip Technology and Planetek Italia integrated hardware-accelerated machine learning on satellites to process orbital Earth observation data under strict power and radiation constraints.
Infineon Technologies AG and LS ELECTRIC are collaborating to develop high-efficiency direct current power infrastructure for AI data centers and next-generation power grids.
This collaborative research project develops bacterial cellulose circuit carriers and additive manufacturing processes for sustainable next-generation printed circuit boards.
ROHM introduces surface-mount power devices with standard footprint compatibility, designed to enhance server power supply efficiency and support high-density industrial applications.
Swissbit AG and Nexperia B.V. collaborate to develop secure storage and semiconductor solutions for AI accelerators, cloud data centers, and server systems.
Keysight Technologies has launched Eggplant Find by Description to automate interface element identification using textual descriptions instead of image-based screenshots.