16
'26
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Microchip News
16
'26
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Omron Components News
Miniature MOSFET relays target high-speed test systems
OMRON Components Europe has introduced ultra-compact G3VM MOSFET relays designed for high-density, high-speed switching in test and measurement equipment.
15
'26
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OMRON News
Miniature MOSFET relays target high-speed test switching
OMRON expands its G3VM range with 20 V and 40 V parts designed to reduce capacitance, leakage, and switching delays in high-channel ATE.
15
'26
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Northrop Grumman News
Accelerated Radiation Testing for Microelectronics
Northrop Grumman demonstrates compact radiation-testing technology under DARPA program to shorten qualification cycles for space and nuclear microelectronics.
15
'26
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Vishay News
Vishay expands 193 PUR-SI snap-in capacitors with 550 V and 600 V ratings
Higher voltage headroom reduces component count, saves space, and improves DC-link reliability.
15
'26
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Mitsubishi Electric News
Mitsubishi Electric samples new trench SiC-MOSFET bare dies
Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.
15
'26
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Microchip News
Military-Qualified Plastic TVS Devices for Harsh Environments
Microchip Technology introduces MIL-PRF-19500-qualified plastic transient voltage suppressors to address weight, cost, and reliability requirements in aerospace and defense electronics.
15
'26
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ATP Electronics News
ATP Electronics launches world’s smallest 6.7 mm e.MMC for next-generation smart wearables
Ultra-compact e.MMC delivers major size reduction, high power efficiency, and robust performance for space-constrained designs.
15
'26
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Yamaha Motor News
Yamaha Motor launches YRH10W hybrid placer for 12-inch wafers and large PCB handling
High-speed, high-accuracy hybrid placer for advanced semiconductor and power electronics production.
14
'26
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Parker News
