Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.
A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.
Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.
Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.
The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.
Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.
DFI (2397), the global leader in embedded motherboards and industrial computers, will release their latest products and embedded AI solutions this year at Embedded World in Germany.