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CEVA News

CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture

3rd generation NeuPro AI/ML architecture offers scalable performance of 20 to 1,200 TOPS at SoC and Chiplet levels, lowers memory bandwidth by 6X.Targets broad use of AI/ML in automotive, industrial, 5G networks and handsets, surveillance cameras, and Edge Compute.

TDK News

HDD Heads: TDK reports successfully shipped prototype HDD-Heads with next generation recording technology, MAS-MAMR

TDK Corporation (TSE:6762) announces that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.

Anritsu News

Anritsu, in Collaboration with Qualcomm, Verifies Industry First Enhanced Network Slicing and Power Saving Tests for 5G New Radio Standalone

Anritsu Corporation is pleased to announce that the first enhanced Network Slicing and User Equipment (UE) power saving Protocol Conformance Tests for 5G New Radio (NR) Standalone (SA) have been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.

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