09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon Expands AI Data Center Power Protection

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

AMD News

AMD 5th Gen EPYC Processors Power AWS Instances

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Tomahawk 6 Davisson Achieves 102.4 Tbps

Broadcom launched Tomahawk^® 6 – Davisson, the industry's first 102.4 Tbps Ethernet switch with Co-Packaged Optics (CPO), doubling bandwidth and cutting optical interconnect power consumption by 70% for AI networking.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Three Magnet-Free Inductive Position Sensors & Design Tool

New inductive sensors deliver up to 19-bit precision, 0.01° accuracy, and 600K RPM performance, supported by a web-based coil optimization platform.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

OMRON News

OMRON reveals 300A/1000V power relay with auxiliary contact for diagnostics

With a footprint of 56.7mm x 61.0mm, and 58.4mm high, the G9KA-1A1B-E has a compact outline and permits easy, solderable assembly.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Nordic Semiconductor and Sateliot Advance LEO Satellite IoT Connectivity

Nordic Semiconductor, Sateliot, and Gatehouse Satcom achieve chip-to-cloud IoT communication via LEO satellites, enabling global low-power connectivity for remote industries.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Expands Inductor Portfolio With Over 2000 New SKUs

Vishay Intertechnology expands its inductor and FCD portfolio with 2000+ new SKUs and global capacity growth to meet industrial and consumer demand.

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08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Pickering Electronics News

Pickering Showcases Industry-First 20kV Customizable Reed Relays at Kyushu Semiconductor Industry Exhibition 2025

New Series 600 relays deliver up to 20kV across switch contacts and 25kV isolation, redefining high-voltage semiconductor test performance.

Read more…

07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-07T00:00:00+00:00" | date "longDate" }}

AMD News

AMD and OpenAI partner to deploy 6 GW of AMD GPUs

OpenAI will deploy 6 GW of AMD Instinct GPUs through a multi-year, multi-generation agreement, starting with an initial 1 GW deployment of the MI450 Series in late 2026.

Read more…

07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-07T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS adds remote PoE Daughterboard to modular camera concept

Power supply and Gigabit Ethernet via a single cable simplify the integration of uEye cameras.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

Infineon Expands AI Data Center Power Protection

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

AMD 5th Gen EPYC Processors Power AWS Instances

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

Broadcom Tomahawk 6 Davisson Achieves 102.4 Tbps

Broadcom launched Tomahawk^® 6 – Davisson, the industry's first 102.4 Tbps Ethernet switch with Co-Packaged Optics (CPO), doubling bandwidth and cutting optical interconnect power consumption by 70% for AI networking.

Renesas Introduces Three Magnet-Free Inductive Position Sensors & Design Tool

New inductive sensors deliver up to 19-bit precision, 0.01° accuracy, and 600K RPM performance, supported by a web-based coil optimization platform.

OMRON reveals 300A/1000V power relay with auxiliary contact for diagnostics

With a footprint of 56.7mm x 61.0mm, and 58.4mm high, the G9KA-1A1B-E has a compact outline and permits easy, solderable assembly.

Nordic Semiconductor and Sateliot Advance LEO Satellite IoT Connectivity

Nordic Semiconductor, Sateliot, and Gatehouse Satcom achieve chip-to-cloud IoT communication via LEO satellites, enabling global low-power connectivity for remote industries.

Vishay Expands Inductor Portfolio With Over 2000 New SKUs

Vishay Intertechnology expands its inductor and FCD portfolio with 2000+ new SKUs and global capacity growth to meet industrial and consumer demand.

Pickering Showcases Industry-First 20kV Customizable Reed Relays at Kyushu Semiconductor Industry Exhibition 2025

New Series 600 relays deliver up to 20kV across switch contacts and 25kV isolation, redefining high-voltage semiconductor test performance.

AMD and OpenAI partner to deploy 6 GW of AMD GPUs

OpenAI will deploy 6 GW of AMD Instinct GPUs through a multi-year, multi-generation agreement, starting with an initial 1 GW deployment of the MI450 Series in late 2026.

IDS adds remote PoE Daughterboard to modular camera concept

Power supply and Gigabit Ethernet via a single cable simplify the integration of uEye cameras.

International

Market Overview

Technical Articles

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

Broadcom launched Tomahawk® 6 – Davisson, the industry's first 102.4 Tbps Ethernet switch with Co-Packaged Optics (CPO), doubling bandwidth and cutting optical interconnect power consumption by 70% for AI networking.

New inductive sensors deliver up to 19-bit precision, 0.01° accuracy, and 600K RPM performance, supported by a web-based coil optimization platform.

With a footprint of 56.7mm x 61.0mm, and 58.4mm high, the G9KA-1A1B-E has a compact outline and permits easy, solderable assembly.

Nordic Semiconductor, Sateliot, and Gatehouse Satcom achieve chip-to-cloud IoT communication via LEO satellites, enabling global low-power connectivity for remote industries.

Vishay Intertechnology expands its inductor and FCD portfolio with 2000+ new SKUs and global capacity growth to meet industrial and consumer demand.

New Series 600 relays deliver up to 20kV across switch contacts and 25kV isolation, redefining high-voltage semiconductor test performance.

OpenAI will deploy 6 GW of AMD Instinct GPUs through a multi-year, multi-generation agreement, starting with an initial 1 GW deployment of the MI450 Series in late 2026.

Power supply and Gigabit Ethernet via a single cable simplify the integration of uEye cameras.

International

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

Broadcom launched Tomahawk^® 6 – Davisson, the industry's first 102.4 Tbps Ethernet switch with Co-Packaged Optics (CPO), doubling bandwidth and cutting optical interconnect power consumption by 70% for AI networking.