09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-09T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and UMC extend automotive partnership with long-term agreement for 40nm eNVM microcontroller production

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

Read more…

09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-09T00:00:00+00:00" | date "longDate" }}

ST News

STMICROELECTRONICS DEVELOPS ALL-IN-ONE MOTION AND BONE-CONDUCTION SENSOR

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Takes Developer Experience to the Next Level with New MCUXpresso Tools

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk is Presenting the AIoT Solutions at Embedded World 2023

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon AIROC CYW43022 Wi-Fi 5 and Bluetooth^® combo extends battery life for IoT applications with up to 65 percent power reduction

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

Celus News

CELUS Opens New Platform for Beta Testing

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

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HMS Industrial Networks AB

HMS Networks Launches Ewon Talk2M Visualization for Enhanced Machine Monitoring and Efficiency

Talk2M^® Visualization Offers a Fast and Cost-Efficient Solution for Machine Builders to Visualize Data and Improve Decision-Making Processes.

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-07T00:00:00+00:00" | date "longDate" }}

Analog Devices News

Analog Devices and Marvell Showcase Next-Generation 5G Massive MIMO Radio Unit Platform at Mobile World Congress 2023

Collaboration combines industry-leading digital beamforming and transceiver silicon to propel advanced massive MIMO into mainstream.

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-07T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon to acquire GaN Systems, strengthening its GaN portfolio and further reinforcing its global leadership in Power Systems

Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-07T00:00:00+00:00" | date "longDate" }}

DFI

DFI To Showcase Latest Embedded Products and AIoT Solutions at Embedded World, Focusing on Edge AI Opportunities

DFI (2397), the global leader in embedded motherboards and industrial computers, will release their latest products and embedded AI solutions this year at Embedded World in Germany.

Read more…

Technical Articles

TDK IMPLEMENTS TEMPERATURE SENSING OF LED FLASH WITH NTC THERMISTOR

Infineon and UMC extend automotive partnership with long-term agreement for 40nm eNVM microcontroller production

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

STMICROELECTRONICS DEVELOPS ALL-IN-ONE MOTION AND BONE-CONDUCTION SENSOR

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

NXP Takes Developer Experience to the Next Level with New MCUXpresso Tools

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Innodisk is Presenting the AIoT Solutions at Embedded World 2023

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Infineon AIROC CYW43022 Wi-Fi 5 and Bluetooth^® combo extends battery life for IoT applications with up to 65 percent power reduction

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

CELUS Opens New Platform for Beta Testing

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

HMS Networks Launches Ewon Talk2M Visualization for Enhanced Machine Monitoring and Efficiency

Talk2M^® Visualization Offers a Fast and Cost-Efficient Solution for Machine Builders to Visualize Data and Improve Decision-Making Processes.

Analog Devices and Marvell Showcase Next-Generation 5G Massive MIMO Radio Unit Platform at Mobile World Congress 2023

Collaboration combines industry-leading digital beamforming and transceiver silicon to propel advanced massive MIMO into mainstream.

Infineon to acquire GaN Systems, strengthening its GaN portfolio and further reinforcing its global leadership in Power Systems

Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.

DFI To Showcase Latest Embedded Products and AIoT Solutions at Embedded World, Focusing on Edge AI Opportunities

DFI (2397), the global leader in embedded motherboards and industrial computers, will release their latest products and embedded AI solutions this year at Embedded World in Germany.

International

Technical Articles

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

Talk2M® Visualization Offers a Fast and Cost-Efficient Solution for Machine Builders to Visualize Data and Improve Decision-Making Processes.

Collaboration combines industry-leading digital beamforming and transceiver silicon to propel advanced massive MIMO into mainstream.

Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.

DFI (2397), the global leader in embedded motherboards and industrial computers, will release their latest products and embedded AI solutions this year at Embedded World in Germany.

International

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

Talk2M^® Visualization Offers a Fast and Cost-Efficient Solution for Machine Builders to Visualize Data and Improve Decision-Making Processes.