29 {{ "2026-05-29T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Contactless Payment Tokenization Integration for Active Smart Wearables

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

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Kontron News

3U VPX AI Computing for Defense Systems

Kontron introduces a ruggedized 3U VPX computing platform combining CPU, GPU, and AI acceleration for embedded defense and aerospace workloads.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

High-Speed Quad-Channel Digital Isolators Expand Industrial Signal Protection

Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

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Würth Elektronik News

Vehicle Power Distribution Systems Target Off-Highway Electrification

Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

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Anritsu News

Anritsu and YOTASYS Collaborate on AI-Driven Spectrum Monitoring Solutions

Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-28T00:00:00+00:00" | date "longDate" }}

Broadcom News

Integrated 5G and Wi-Fi 8 FWA Platform for the FWA market

Broadcom and Samsung Electronics collaborate on a new broadband-optimized fixed wireless access reference platform integrating Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G Modem.

Read more…

28 {{ "2026-05-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-28T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Electro-Optical-Electrical Simulation for Data Centers and High-Speed Ethernet Designs

Keysight Technologies integrates a complete EOE simulation solution into ADS 2026 for modeling signal paths in AI infrastructures and high-performance computing systems.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Unveils Integrated Five-Layer Edge AI Ecosystem at COMPUTEX 2026

The showcase combines AI compute platforms, industrial storage, connectivity, sensing, and software technologies to support scalable and secure AI deployment across enterprise and industrial applications.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight At IMS 2026

From June 7-12, in Boston, the company will showcase automated RF design simulation, environment emulation, and validation technologies to accelerate development across wireless, satellite, and 6G applications.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

Aetina

Aetina Demonstrates Edge AI Platforms for Robotics, Vision AI and Enterprise Automation at COMPUTEX 2026

Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.

Read more…

Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Nanocrystalline Core Inductors for High-Frequency Power Converters

Case studies

Integrated SMT Line for Complex Assemblies

Contactless Payment Tokenization Integration for Active Smart Wearables

Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.

3U VPX AI Computing for Defense Systems

Kontron introduces a ruggedized 3U VPX computing platform combining CPU, GPU, and AI acceleration for embedded defense and aerospace workloads.

High-Speed Quad-Channel Digital Isolators Expand Industrial Signal Protection

Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.

Vehicle Power Distribution Systems Target Off-Highway Electrification

Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.

Anritsu and YOTASYS Collaborate on AI-Driven Spectrum Monitoring Solutions

Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.

Integrated 5G and Wi-Fi 8 FWA Platform for the FWA market

Broadcom and Samsung Electronics collaborate on a new broadband-optimized fixed wireless access reference platform integrating Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G Modem.

Electro-Optical-Electrical Simulation for Data Centers and High-Speed Ethernet Designs

Keysight Technologies integrates a complete EOE simulation solution into ADS 2026 for modeling signal paths in AI infrastructures and high-performance computing systems.

Innodisk Unveils Integrated Five-Layer Edge AI Ecosystem at COMPUTEX 2026

The showcase combines AI compute platforms, industrial storage, connectivity, sensing, and software technologies to support scalable and secure AI deployment across enterprise and industrial applications.

Keysight At IMS 2026

From June 7-12, in Boston, the company will showcase automated RF design simulation, environment emulation, and validation technologies to accelerate development across wireless, satellite, and 6G applications.

Aetina Demonstrates Edge AI Platforms for Robotics, Vision AI and Enterprise Automation at COMPUTEX 2026

Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.

International