The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.
TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.
Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.
Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.
The company collaborates with NVIDIA to advance 800 VDC power architectures, highlighting over 98% efficiency and superior power density versus SiC and lower-voltage GaN solutions.
PCIe 6.0 doubles the bandwidth of PCIe 5.0 to 64 GT/s (giga transfers per second) per lane, providing the necessary data pipeline to keep the most powerful AI accelerators consistently supplied.
Renesas’ GaN-based converters achieve up to 98% efficiency, supporting scalable 48V–800V DC architectures to meet growing AI data center power demands.