Technical Articles

75 GB/s Data Acquisition to Disk

Case studies

Optimizing Plastic Machining for Semiconductor Equipment

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15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

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Radiation-Tolerant GaN Point-of-Load Converters for Space Computing Systems

Microchip Technology has released the POL-05-20S-T point-of-load converter to deliver high-current core power for radiation-exposed processing platforms.

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15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Keysight Introduces PCIe 7.0 Protocol Test Solution

Instant link-up and deep protocol visibility reduce risk and shorten next generation system development.

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15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Keysight Introduces Velocity 4900 Layer-1 Switches for Test Labs

Software-controlled switches automate physical test environments to modernize network laboratories for AI and 6G development.

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15 {{ "2026-10-15T00:00:00+00:00" | date "MMM" }} '26

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Bodewell Group News

Scaling Through-Glass Via Metallization for Panel-Level Packaging

VON ARDENNE expands semiconductor deposition to panel-level packaging using high-power impulse magnetron sputtering on its HISS platform to resolve through-glass via metallization limits.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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TDK News

TDK launches PositionSense 9-axis sensor for physical AI devices

The two-chip solution integrates a 6-axis IMU and 3-axis magnetometer for accurate navigation in GPS-denied environments.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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Siemens News

Semiconductor Test Pattern Execution High Speed Interfaces

Siemens EDA launches Tessent Silicon Executable software to translate and run design-for-test patterns natively across automated test equipment, bench, and system-level environments.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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ZEISS News

Advanced Packaging Solutions for X-Ray Inspection and Warpage Correction

ZEISS is expanding its semiconductor manufacturing portfolio with new metrology equipment designed to address process control challenges in high-density chiplet architectures.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

Dual-Range MEMS Pressure Sensor for Altitude and Depth Measurement

STMicroelectronics introduces a compact piezoresistive sensor designed to streamline circuitry in wearable electronics by combining atmospheric and deep-water pressure monitoring.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Dual-Die Magnetic Motor Position Sensors for ASIL D By-Wire Applications

TDK introduces Micronas HAR 3025 with stray-field compensation to ensure fail-operational commutation in redundant automotive actuators.

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14 {{ "2026-10-14T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Compact Low-Voltage eFuse ICs

Toshiba Electronic Devices and Storage Corporation introduces the TCKE5 Series of low-voltage eFuse ICs, protecting compact industrial rails and portable electronics from overcurrent and short-circuit faults.

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