The powertrain business area of Continental Vitesco Technologies, a leading supplier in the field of vehicle electrification, and ROHM Semiconductor, a leading company in SiC power semiconductors, have recently signed a development partnership, beginning in June 2020.
How can mass production methods be applied to individualized products? One answer is to use a combination of digital manufacturing technologies, for example by integrating digital printing and laser processing into traditional manufacturing processes. This paves the way for in-line product customization. Six Fraunhofer institutes have pooled their expertise to take the new process to the next level.
TOKYO—Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has added “TC9594XBG” and “TC9595XBG,” new interface bridge ICs for automotive In-Vehicle Infotainment (IVI) systems, to its lineup of display interface bridge ICs. Sample shipments start this month.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TPD4162F,” a high-voltage intelligent power device (IPD) housed in a small surface mount package, designed to drive motors in products such as air conditioners, air purifiers and pumps. Mass production shipments start today.
Anritsu Corporation is pleased to announce the start of sales of its USB4 receiver test solution using the company's Signal Quality Analyzer-R MP1900A in combination with automation software from Granite River Labs or Teledyne LeCroy to control a connected oscilloscope and implement tests meeting the latest USB4 standards.