07 {{ "2023-11-07T00:00:00+00:00" | date "MMM" }} '23

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Tasking News

TASKING, Andes, and MachineWare Team up to Facilitate Rapid Development of RISC-V ASIL Compliant Automotive Silicon

To support SoC design teams in the realm of firmware and MCAL development.

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07 {{ "2023-11-07T00:00:00+00:00" | date "MMM" }} '23

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Mediatek News

MEDIATEK PRESENTS NEW ALL BIG CORE DESIGN FOR FLAGSHIP DIMENSITY 9300 CHIPSET

Supercharged SoC supports generative AI on-device processing for seamless, secure edge AI experiences.

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07 {{ "2023-11-07T00:00:00+00:00" | date "MMM" }} '23

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STMicroelectronics News

COMMSCOPE AND STMICROELECTRONICS MAKE MATTER PROVISIONING FOR IOT DEVICES SECURE AND EASY

The integrated solution of PKIWorks platform with STM32WB wireless microcontroller enables IoT security for Matter device development.

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06 {{ "2023-11-06T00:00:00+00:00" | date "MMM" }} '23

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PEPPERL+FUCHS PROCESS AUTOMATION

Smart-Ex^® 03 – the new intrinsically safe 5G smartphone from Pepperl+Fuchs for future-oriented digitalization of hazardous areas

Pepperl+Fuchs presents the intrinsically safe Smart-Ex^® 03, a new and future-proof 5G- and Wi-Fi 6-enabled smartphone that was developed entirely in-house in Europe.

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06 {{ "2023-11-06T00:00:00+00:00" | date "MMM" }} '23

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Intel News

INTEL, DELL POWER UK’S FASTEST AI SUPERCOMPUTER

Dawn, a joint effort by Dell Technologies, Intel, University of Cambridge and UKRI, will launch the UK’s recently announced AI Research Resource to solve academic, industrial computational challenges.

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04 {{ "2023-11-04T00:00:00+00:00" | date "MMM" }} '23

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Kontron News

Kontron Web Panel with the high-performance i.MX8M Plus Processor

New Web Panel for use in industrial environments with PoE and a 5-inch display.

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04 {{ "2023-11-04T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser's Empowering Innovation Together Technology Instalment Brings Engineers Up to Speed on WiFi7

Unlock the Benefits of Wifi7 with Expert Insights and In-depth Discussion.

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03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-03T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Develops the First Silicon Capacitor BTD1RVFL Series

Achieving the industry’s smallest size in a mass-produced surface mount package contributes to greater space savings in smartphones and other compact devices.

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03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

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Picocom News

Picocom introduces industry’s first system-on-chip for 5G small cell Open RAN radio units

Picocom, has announced that it has launched PC805, a new system-on-chip (SoC) optimised for 5G small cell Open RAN radio units (O-RUs).

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03 {{ "2023-11-03T00:00:00+00:00" | date "MMM" }} '23

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Toshiba News

New MikroElektronika Click Boards™ feature Toshiba digital isolators for isolated signal transmission in industrial applications

5kVrms/150Mbps 4-channel ICs for SPI, UART, and general I/O isolation now available on evaluation boards.

Read more…

To support SoC design teams in the realm of firmware and MCAL development.

Supercharged SoC supports generative AI on-device processing for seamless, secure edge AI experiences.

The integrated solution of PKIWorks platform with STM32WB wireless microcontroller enables IoT security for Matter device development.

Pepperl+Fuchs presents the intrinsically safe Smart-Ex® 03, a new and future-proof 5G- and Wi-Fi 6-enabled smartphone that was developed entirely in-house in Europe.

Dawn, a joint effort by Dell Technologies, Intel, University of Cambridge and UKRI, will launch the UK’s recently announced AI Research Resource to solve academic, industrial computational challenges.

New Web Panel for use in industrial environments with PoE and a 5-inch display.

Unlock the Benefits of Wifi7 with Expert Insights and In-depth Discussion.

Achieving the industry’s smallest size in a mass-produced surface mount package contributes to greater space savings in smartphones and other compact devices.

Picocom, has announced that it has launched PC805, a new system-on-chip (SoC) optimised for 5G small cell Open RAN radio units (O-RUs).

5kVrms/150Mbps 4-channel ICs for SPI, UART, and general I/O isolation now available on evaluation boards.

International

Pepperl+Fuchs presents the intrinsically safe Smart-Ex^® 03, a new and future-proof 5G- and Wi-Fi 6-enabled smartphone that was developed entirely in-house in Europe.