21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon extends its XDP digital protection product family with new 48 V hot swap controllers optimized for AI servers

Infineon Technologies AG expands its XDP digital protection product family with the XDP711-001, a 48 V wide input voltage range digital hot swap controller with a programmable safe operating area control designed for high-power AI servers.

Read more…

21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-21T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip's AVR SD microcontrollers enhance safety, reduce design costs, and complexity

Microchip’s AVR SD MCU family enables industry-standard functional safety compliance at a price point under a dollar.

Read more…

21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-21T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers

Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled.

Read more…

21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-21T00:00:00+00:00" | date "longDate" }}

Conrad News

Conrad Unveils Fluke LinkIQ Duo: A Powerful Cable, WiFi, and Network Tester

Fluke Networks enhances its LinkIQ Duo with advanced WiFi 6E troubleshooting, offering an all-in-one solution for cable, WiFi, and network testing to meet the demands of high-bandwidth networks.

Read more…

21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-21T00:00:00+00:00" | date "longDate" }}

Rutronik News

CMB100 series from Telit Cinterion saves development and certification costs

Rutronik is now stocking the CMB100 series from Telit Cinterion, LTE-based IoT products for industry.

Read more…

21 {{ "2025-03-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-21T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Delivers New Silicon Labs SiWGx917Y Wi-Fi 6 plus Bluetooth LE 5.4 Modules

Mouser Electronics is shipping Silicon Labs’ SiWx917Y wireless modules, offering ultra-low-power Wi-Fi 6, Bluetooth LE 5.4, and Matter connectivity for IoT devices.

Read more…

20 {{ "2025-03-20T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-20T00:00:00+00:00" | date "longDate" }}

Delta Electronics

Delta Unveils Next-Generation DC Wallbox 50kW EV Charger with Advanced Features for Public Charging

Delta, a global leader in power management and a provider of IoT-based smart green solutions announced the launch of its next-generation DC Wallbox 50kW EV charger.

Read more…

20 {{ "2025-03-20T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-20T00:00:00+00:00" | date "longDate" }}

TDK News

TDK launches automotive power-over-coax inductors for up to 1600 mA

TDK expands its ADL3225VF series of wire-wound inductors for automotive PoC, with mass production starting in March 2025.

Read more…

20 {{ "2025-03-20T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-20T00:00:00+00:00" | date "longDate" }}

NXP News

NXP presents the FRDM i.MX 91 Development Board

Built around the i.MX 91 applications processor, this board is designed to accelerate industrial and IoT development, offering a cost-effective, secure and connectivity-rich platform.

Read more…

20 {{ "2025-03-20T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-20T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

TI presents new power management chips for modern data centers

The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Infineon extends its XDP digital protection product family with new 48 V hot swap controllers optimized for AI servers

Infineon Technologies AG expands its XDP digital protection product family with the XDP711-001, a 48 V wide input voltage range digital hot swap controller with a programmable safe operating area control designed for high-power AI servers.

Microchip's AVR SD microcontrollers enhance safety, reduce design costs, and complexity

Microchip’s AVR SD MCU family enables industry-standard functional safety compliance at a price point under a dollar.

SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers

Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled.

Conrad Unveils Fluke LinkIQ Duo: A Powerful Cable, WiFi, and Network Tester

Fluke Networks enhances its LinkIQ Duo with advanced WiFi 6E troubleshooting, offering an all-in-one solution for cable, WiFi, and network testing to meet the demands of high-bandwidth networks.

CMB100 series from Telit Cinterion saves development and certification costs

Rutronik is now stocking the CMB100 series from Telit Cinterion, LTE-based IoT products for industry.

Mouser Delivers New Silicon Labs SiWGx917Y Wi-Fi 6 plus Bluetooth LE 5.4 Modules

Mouser Electronics is shipping Silicon Labs’ SiWx917Y wireless modules, offering ultra-low-power Wi-Fi 6, Bluetooth LE 5.4, and Matter connectivity for IoT devices.

Delta Unveils Next-Generation DC Wallbox 50kW EV Charger with Advanced Features for Public Charging

Delta, a global leader in power management and a provider of IoT-based smart green solutions announced the launch of its next-generation DC Wallbox 50kW EV charger.

TDK launches automotive power-over-coax inductors for up to 1600 mA

TDK expands its ADL3225VF series of wire-wound inductors for automotive PoC, with mass production starting in March 2025.

NXP presents the FRDM i.MX 91 Development Board

Built around the i.MX 91 applications processor, this board is designed to accelerate industrial and IoT development, offering a cost-effective, secure and connectivity-rich platform.

TI presents new power management chips for modern data centers

The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.

International