09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Three Magnet-Free Inductive Position Sensors & Design Tool

New inductive sensors deliver up to 19-bit precision, 0.01° accuracy, and 600K RPM performance, supported by a web-based coil optimization platform.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

OMRON News

OMRON reveals 300A/1000V power relay with auxiliary contact for diagnostics

With a footprint of 56.7mm x 61.0mm, and 58.4mm high, the G9KA-1A1B-E has a compact outline and permits easy, solderable assembly.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Nordic Semiconductor and Sateliot Advance LEO Satellite IoT Connectivity

Nordic Semiconductor, Sateliot, and Gatehouse Satcom achieve chip-to-cloud IoT communication via LEO satellites, enabling global low-power connectivity for remote industries.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Expands Inductor Portfolio With Over 2000 New SKUs

Vishay Intertechnology expands its inductor and FCD portfolio with 2000+ new SKUs and global capacity growth to meet industrial and consumer demand.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Pickering Electronics News

Pickering Showcases Industry-First 20kV Customizable Reed Relays at Kyushu Semiconductor Industry Exhibition 2025

New Series 600 relays deliver up to 20kV across switch contacts and 25kV isolation, redefining high-voltage semiconductor test performance.

Read more…

07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-07T00:00:00+00:00" | date "longDate" }}

AMD News

AMD and OpenAI partner to deploy 6 GW of AMD GPUs

OpenAI will deploy 6 GW of AMD Instinct GPUs through a multi-year, multi-generation agreement, starting with an initial 1 GW deployment of the MI450 Series in late 2026.

Read more…

07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-07T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS adds remote PoE Daughterboard to modular camera concept

Power supply and Gigabit Ethernet via a single cable simplify the integration of uEye cameras.

Read more…

07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-07T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Expands Portfolio with PANJIT's High-Efficiency Bridge Rectifiers

Rutronik now offers PANJIT's LV series bridge rectifiers, providing 25A current in a GBU-2 package with low VF for server and industrial power supplies.

Read more…

06 {{ "2025-10-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-06T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Tobii and STMicroelectronics Launch Advanced Interior Sensing System

Tobii and STMicroelectronics begin mass production of a single-camera system integrating attention-computing and VD1940 image sensor for advanced driver and occupant monitoring.

Read more…

06 {{ "2025-10-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-06T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

TE Connectivity Unveils Inside Device Connectivity Portfolio

New compact connectors deliver up to 45 A capacity, high EMI resilience, and vibration tolerance—optimising ECUs, HPCs, and ADAS integration in next-gen software-defined vehicles.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

Renesas Introduces Three Magnet-Free Inductive Position Sensors & Design Tool

New inductive sensors deliver up to 19-bit precision, 0.01° accuracy, and 600K RPM performance, supported by a web-based coil optimization platform.

OMRON reveals 300A/1000V power relay with auxiliary contact for diagnostics

With a footprint of 56.7mm x 61.0mm, and 58.4mm high, the G9KA-1A1B-E has a compact outline and permits easy, solderable assembly.

Nordic Semiconductor and Sateliot Advance LEO Satellite IoT Connectivity

Nordic Semiconductor, Sateliot, and Gatehouse Satcom achieve chip-to-cloud IoT communication via LEO satellites, enabling global low-power connectivity for remote industries.

Vishay Expands Inductor Portfolio With Over 2000 New SKUs

Vishay Intertechnology expands its inductor and FCD portfolio with 2000+ new SKUs and global capacity growth to meet industrial and consumer demand.

Pickering Showcases Industry-First 20kV Customizable Reed Relays at Kyushu Semiconductor Industry Exhibition 2025

New Series 600 relays deliver up to 20kV across switch contacts and 25kV isolation, redefining high-voltage semiconductor test performance.

AMD and OpenAI partner to deploy 6 GW of AMD GPUs

OpenAI will deploy 6 GW of AMD Instinct GPUs through a multi-year, multi-generation agreement, starting with an initial 1 GW deployment of the MI450 Series in late 2026.

IDS adds remote PoE Daughterboard to modular camera concept

Power supply and Gigabit Ethernet via a single cable simplify the integration of uEye cameras.

Rutronik Expands Portfolio with PANJIT's High-Efficiency Bridge Rectifiers

Rutronik now offers PANJIT's LV series bridge rectifiers, providing 25A current in a GBU-2 package with low VF for server and industrial power supplies.

Tobii and STMicroelectronics Launch Advanced Interior Sensing System

Tobii and STMicroelectronics begin mass production of a single-camera system integrating attention-computing and VD1940 image sensor for advanced driver and occupant monitoring.

TE Connectivity Unveils Inside Device Connectivity Portfolio

New compact connectors deliver up to 45 A capacity, high EMI resilience, and vibration tolerance—optimising ECUs, HPCs, and ADAS integration in next-gen software-defined vehicles.

International