The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants.
TDK Corporation presents ModCapTM HF, a modular capacitor concept for DC link applications that is able to work at very high switching frequencies. The six newly developed power capacitors of the B25647A* series are available for rated voltages from 900 V to 1600 V and cover a capacitance spectrum from 640 µF to 1850 µF.
CUI Devices’ Switches Group has announced the introduction of one of the industry’s smallest tactile switches. Housed in an ultra-compact 3 x 2 x 0.6 mm package, the TS19 series carries an IP67 rating for dealing with moisture and environmental contaminants as well as a rugged lifecycle rating up to 300,000 cycles.
Vector presents its compact multi-gig USB-to-Ethernet adapter VN5601. The adapter is not only high performing, its compact dimensions make it ideally suited for portable use. It also offers easy connection to Vector Hardware.
Rohde & Schwarz and Broadcom have successfully validated the R&S CMP180 radio communication tester for Broadcom Wi-Fi 7 chipsets. OEMs and ODMs of wireless devices can now get their first Wi-Fi 7 products ready for market.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced the launch of a new resource site dedicated to sensor design guides.
Toshiba Corporation has unveiled a technology breakthrough in photoluminescence, a novel phosphor that delivers excellent solubility in polymers or organic solvents, where it is transparent and colorless under visible light, and that emits persistent red-light emissions under UV light, with excellent color purity and a luminescence six times that of current phosphors.
Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.