Case studies

Low-Power Congatec SMARC Modules for Powerful AI Inference

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

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STMicroelectronics News

STMicroelectronics Unveils Human Presence Detection to Enhance PC User Experience

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

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CEA Leti News

Applied Materials and CEA-Leti Expand Joint Lab to Pioneer Energy-Efficient AI Chips

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

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Siemens digital Industry Software News

Siemens, Samsung Foundry collaborate on advanced EDA, product certifications

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

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LAPP UK

LAPP Buys Industrial Connectors Company in China

By joining forces with the Chinese circular connectors specialist based in southern China, LAPP aims to expand its global market presence and manufacturing footprint for industrial connectors.

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Anritsu News

Anritsu Launches Compact MG36021A Synthesiser

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

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Kyocera News

KYOCERA AVX Chip Antennas Support the Surging SiP Market

KYOCERA AVX offers compact, high-performance 2.4GHz antennas ideal for SiP modules in IoT, wearables, and automotive, enabling faster design and miniaturization.

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Keysight technologies News

Keysight, NTT Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G

Achieved 280 Gbps in the 300 GHz band, surpassing the previous milestone of 240 Gbps, and accelerating the characterization of 6G sub-THz components.

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Rutronik News

Toshiba Launches Compact, High-Speed Photo Relays for Enhanced Semiconductor Testing Efficiency

Rutronik presents Toshiba’s TLP3414S and TLP3431S photo relays with faster switching, low resistance, and compact design for high-performance semiconductor test systems.

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Mitsubishi Electric News

Mitsubishi Electric Verifies Compact GaN Amplifier for 5G-Advanced

World’s first 7GHz GaN power amplifier module achieves top efficiency and compact design for next-gen 5G base stations.

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Rohm Semiconductors News

ROHM Builds the Future of AI with Optimized Solutions for NVIDIA 800V Architecture

ROHM supports NVIDIA’s 800V HVDC AI data centers with advanced SiC and GaN power semiconductors, enabling efficient, scalable, and sustainable high-voltage power infrastructure.

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