13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

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Vishay News

Vishay Launches Compact High-Sensitivity Photodiode for Biomedical Devices

Vishay’s VEMD8083 silicon PIN photodiode combines compact design, high sensitivity, and fast response, delivering up to 16 μA light current for biomedical wearables.

Read more…

13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

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Microchip News

Microchip endpoint devices accelerate new zonal car connectivity

The new 10BASE-T1S devices provide a simple, cost-effective connection from remote sensors to zonal gateways, greatly accelerating the next-generation automotive architecture.

Read more…

13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-13T00:00:00+00:00" | date "longDate" }}

LEMO

LEMO Launches REDEL SP IP68 Series of Resin-Free Watertight Connectors

Compact, robust push-pull connectors deliver high-density, medical-grade sealing without resin.

Read more…

13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-13T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Group Unveils New Edge AI Strategy, as Global “Keystone” for Edge AI Transformation

Focusing on Industry AI and Enterprise AI, Innodisk strengthens partnerships with Intel, NVIDIA, Qualcomm, and Axelera AI to drive scalable, real-world AI deployments.

Read more…

13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-13T00:00:00+00:00" | date "longDate" }}

Trumpf News

TRUMPF makes semiconductor manufacturing more efficient and precise

TRUMPF increases efficiency and precision in chip production with the TruPlasma RF Series G3, web-based control, real-time monitoring, and pulse frequencies up to 400 kHz.

Read more…

13 {{ "2025-11-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-13T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Launches 9600 MT/s Gen6 DDR5 RCD

Delivers 9600 MT/s with a 10% bandwidth boost, enhanced signal integrity, advanced diagnostics, and backward compatibility for next-gen AI and HPC workloads.

Read more…

12 {{ "2025-11-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-12T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon’s GaN Technology Powers Enphase IQ9 Solar Microinverter

CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.

Read more…

12 {{ "2025-11-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-12T00:00:00+00:00" | date "longDate" }}

Ransemi News

Gigalane Selects RANsemi for Next-Generation Radio Units

Collaboration combines Gigalane’s RF heritage with RANsemi’s software-defined baseband technology to accelerate Private 5G deployments in Korea.

Read more…

12 {{ "2025-11-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-11-12T00:00:00+00:00" | date "longDate" }}

Beckhoff News

Beckhoff Automation Portfolio Powers Next-Generation Semiconductor Manufacturing Excellence

Beckhoff demonstrates how EtherCAT protocol, PC-based control, AI-integrated TwinCAT 3 software, and XPlanar systems transform semiconductor production from wafer fabrication to packaging.

Read more…

11 {{ "2025-11-11T00:00:00+00:00" | date "MMM" }} '25

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NXP News

NXP Advances Post-Quantum Security Across Product Portfolio

Upcoming processor and security products integrate quantum-resistant cryptography, supporting global migration deadlines toward 2027–2035 and ensuring long-term protection for embedded systems.

Read more…

Market Overview

The 5G RedCap Connects IoT Devices at Lower Cost

Technical Articles

How Solar Radiation Disrupts Electronic Systems and What Solutions Can Protect Them

Case studies

CompControl automates inbound electronics logistics with machine vision

Vishay Launches Compact High-Sensitivity Photodiode for Biomedical Devices

Vishay’s VEMD8083 silicon PIN photodiode combines compact design, high sensitivity, and fast response, delivering up to 16 μA light current for biomedical wearables.

Microchip endpoint devices accelerate new zonal car connectivity

The new 10BASE-T1S devices provide a simple, cost-effective connection from remote sensors to zonal gateways, greatly accelerating the next-generation automotive architecture.

LEMO Launches REDEL SP IP68 Series of Resin-Free Watertight Connectors

Compact, robust push-pull connectors deliver high-density, medical-grade sealing without resin.

Innodisk Group Unveils New Edge AI Strategy, as Global “Keystone” for Edge AI Transformation

Focusing on Industry AI and Enterprise AI, Innodisk strengthens partnerships with Intel, NVIDIA, Qualcomm, and Axelera AI to drive scalable, real-world AI deployments.

TRUMPF makes semiconductor manufacturing more efficient and precise

TRUMPF increases efficiency and precision in chip production with the TruPlasma RF Series G3, web-based control, real-time monitoring, and pulse frequencies up to 400 kHz.

Renesas Launches 9600 MT/s Gen6 DDR5 RCD

Delivers 9600 MT/s with a 10% bandwidth boost, enhanced signal integrity, advanced diagnostics, and backward compatibility for next-gen AI and HPC workloads.

Infineon’s GaN Technology Powers Enphase IQ9 Solar Microinverter

CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.

Gigalane Selects RANsemi for Next-Generation Radio Units

Collaboration combines Gigalane’s RF heritage with RANsemi’s software-defined baseband technology to accelerate Private 5G deployments in Korea.

Beckhoff Automation Portfolio Powers Next-Generation Semiconductor Manufacturing Excellence

Beckhoff demonstrates how EtherCAT protocol, PC-based control, AI-integrated TwinCAT 3 software, and XPlanar systems transform semiconductor production from wafer fabrication to packaging.

NXP Advances Post-Quantum Security Across Product Portfolio

Upcoming processor and security products integrate quantum-resistant cryptography, supporting global migration deadlines toward 2027–2035 and ensuring long-term protection for embedded systems.

International