29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

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Rohm Semiconductors News

Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs Integrated into SMA’s Large Scale Solar System

SMA Solar Technology AG, adopts Semikron Danfoss’ Module with ROHM's latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

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Congatec News

congatec showcases high-performance embedded building blocks at ElectroneX 2025

congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

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TDK News

TDK showcases latest solutions for green & digital transformation

At PCIM and SENSOR+TEST, TDK presents advanced passive components and sensor technologies for renewable energy, e-mobility, AI, and industry.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

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Cyntec

Cyntec Showcases Power Magnetics and Sensing for E-Mobility at PCIM 2025

Cyntec will showcase its latest innovation for automotive electrification industry at PCIM in Nuremberg Messe from 6th to 8th May.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-29T00:00:00+00:00" | date "longDate" }}

Cambridge GaN Devices News

CGD DEMONSTRATES SUPERIORITY OF ICeGaN IN MOTOR DRIVES, DATA CENTRES AND EVS AT PCIM 2025

Shows breakthrough Combo ICeGaN 100kW+ technology for EV Inverters for the first time in Europe. Visit Hall 7 Booth 657 at Nürnberg Messe, Nuremberg, Germany from May 6-8, 2025.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-29T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Presents Power Step 2 Click Board for Advanced Automation

Power Step 2 Click is a mikroBUS-compatible motor driver that leverages STMicroelectronics’ powerSTEP01 IC for 1/128 microstepping, 85V operation, and 10A RMS current control.

Read more…

28 {{ "2025-04-28T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-28T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Unveils High-Density Power Module for Edge AI

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Read more…

28 {{ "2025-04-28T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-28T00:00:00+00:00" | date "longDate" }}

Pulsiv

Pulsiv Introduces Ultra-Efficient, Low-Heat USB-C Power Modules for Installed Applications

Pulsiv launches groundbreaking 65-70W USB-C modules with 32°C max operating temperature and 97.34% efficiency at PCIM 2025 in Nuremberg, Germany, from May 6–8 at Hall 6 Booth 250.

Read more…

25 {{ "2025-04-25T00:00:00+00:00" | date "MMM" }} '25

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Siemens digital Industry Software News

Siemens and TSMC Partner to Advance Chip Innovation by 2025

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

Read more…

25 {{ "2025-04-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-25T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu and MVG collaborate to support IEEE 802.11be (Wi-Fi 7) OTA measurement solution

Anritsu Corporation introduces a new solution combining MVG’s multi-probe OTA test systems with its MT8862A Wireless Connectivity Test Set to enable IEEE 802.11be (Wi-Fi 7) OTA performance measurements.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs Integrated into SMA’s Large Scale Solar System

SMA Solar Technology AG, adopts Semikron Danfoss’ Module with ROHM's latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”.

congatec showcases high-performance embedded building blocks at ElectroneX 2025

congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.

TDK showcases latest solutions for green & digital transformation

At PCIM and SENSOR+TEST, TDK presents advanced passive components and sensor technologies for renewable energy, e-mobility, AI, and industry.

Cyntec Showcases Power Magnetics and Sensing for E-Mobility at PCIM 2025

Cyntec will showcase its latest innovation for automotive electrification industry at PCIM in Nuremberg Messe from 6th to 8th May.

CGD DEMONSTRATES SUPERIORITY OF ICeGaN IN MOTOR DRIVES, DATA CENTRES AND EVS AT PCIM 2025

Shows breakthrough Combo ICeGaN 100kW+ technology for EV Inverters for the first time in Europe. Visit Hall 7 Booth 657 at Nürnberg Messe, Nuremberg, Germany from May 6-8, 2025.

MIKROE Presents Power Step 2 Click Board for Advanced Automation

Power Step 2 Click is a mikroBUS-compatible motor driver that leverages STMicroelectronics’ powerSTEP01 IC for 1/128 microstepping, 85V operation, and 10A RMS current control.

Microchip Unveils High-Density Power Module for Edge AI

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Pulsiv Introduces Ultra-Efficient, Low-Heat USB-C Power Modules for Installed Applications

Pulsiv launches groundbreaking 65-70W USB-C modules with 32°C max operating temperature and 97.34% efficiency at PCIM 2025 in Nuremberg, Germany, from May 6–8 at Hall 6 Booth 250.

Siemens and TSMC Partner to Advance Chip Innovation by 2025

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

Anritsu and MVG collaborate to support IEEE 802.11be (Wi-Fi 7) OTA measurement solution

Anritsu Corporation introduces a new solution combining MVG’s multi-probe OTA test systems with its MT8862A Wireless Connectivity Test Set to enable IEEE 802.11be (Wi-Fi 7) OTA performance measurements.

International