20 {{ "2025-03-20T00:00:00+00:00" | date "MMM" }} '25

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Omron Components News

Omron's new high-temperature relay permits denser board designs

The G3VM S-VSON(L) MOS FET relay is capable of operating at ambient temperatures of up to 125˚C, improving on previous iterations which were limited to ambient temperatures of 110˚C.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

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Mitsubishi Electric News

Mitsubishi Electric ships 16W GaN power amplifier for 3.6-4.0GHz 5G mMIMO

The 16W GaN power amplifier reduces costs and power consumption while enabling wider deployment of 5G mMIMO base stations.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Kontron News

JUMPtec expands its strategic solution portfolio with Texas Instruments processors

JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers

Infineon Technologies AG global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec heat pipe cooling solution for extreme environmental conditions

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

Advanced Power Management Solutions Include Fuel Gauge ICs, MCU, Pre-Validated Firmware, Software and Documentation to Drastically Simplify Battery Pack Design.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-19T00:00:00+00:00" | date "longDate" }}

ASMPT News

Critical Manufacturing MES Supports Plessey’s Experimental MicroLED Processes

Critical Manufacturing is pleased to announce that Plessey, renowned for its microLED display technology, has selected Critical Manufacturing MES to support its manufacturing workflows.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia presents Only Pulse Capacitors with integrated bleed resistors

The Pulse CF/CFS series ensures high-energy density and high-rate of charge/discharge capability, making it the preferred choice for ignition applications of defense, space launch systems, and oil & gas applications.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Omron's new high-temperature relay permits denser board designs

The G3VM S-VSON(L) MOS FET relay is capable of operating at ambient temperatures of up to 125˚C, improving on previous iterations which were limited to ambient temperatures of 110˚C.

Mitsubishi Electric ships 16W GaN power amplifier for 3.6-4.0GHz 5G mMIMO

The 16W GaN power amplifier reduces costs and power consumption while enabling wider deployment of 5G mMIMO base stations.

JUMPtec expands its strategic solution portfolio with Texas Instruments processors

JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.

Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers

Infineon Technologies AG global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute.

congatec heat pipe cooling solution for extreme environmental conditions

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025.

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

Advanced Power Management Solutions Include Fuel Gauge ICs, MCU, Pre-Validated Firmware, Software and Documentation to Drastically Simplify Battery Pack Design.

Critical Manufacturing MES Supports Plessey’s Experimental MicroLED Processes

Critical Manufacturing is pleased to announce that Plessey, renowned for its microLED display technology, has selected Critical Manufacturing MES to support its manufacturing workflows.

Exxelia presents Only Pulse Capacitors with integrated bleed resistors

The Pulse CF/CFS series ensures high-energy density and high-rate of charge/discharge capability, making it the preferred choice for ignition applications of defense, space launch systems, and oil & gas applications.

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

International