15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX Launches KGP Series Stacked MLCCs

The KGP Series delivers high capacitance, low ESR/ESL, and durable metal lead frames for miniaturised, sustainable, and high-frequency industrial, energy, and downhole applications.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Rutronik News

Rutronik Expands Portfolio With High-Temperature YT Hybrid Capacitors

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Pioneers 12-Disk HDD Stacking Technology

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Yamaha Motor News

Yamaha boosts surface-mount programming efficiency with latest software release

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Co-Designs NVIDIA DGX Spark Superchip

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Lambda Unveils New Modular Power Supply

TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

AMD News

AMD Unveils “Helios” Open Rack Platform for Scalable AI Infrastructure

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

New Tool for Next-Generation Microdisplays

Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

Read more…

15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-15T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

Read more…

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

KYOCERA AVX Launches KGP Series Stacked MLCCs

The KGP Series delivers high capacitance, low ESR/ESL, and durable metal lead frames for miniaturised, sustainable, and high-frequency industrial, energy, and downhole applications.

Rutronik Expands Portfolio With High-Temperature YT Hybrid Capacitors

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

Toshiba Pioneers 12-Disk HDD Stacking Technology

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Yamaha boosts surface-mount programming efficiency with latest software release

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

MediaTek Co-Designs NVIDIA DGX Spark Superchip

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

TDK Lambda Unveils New Modular Power Supply

TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.

AMD Unveils “Helios” Open Rack Platform for Scalable AI Infrastructure

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

New Tool for Next-Generation Microdisplays

Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

STMicroelectronics advances power solutions for 800 VDC architecture for next-generation AI factories

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

International

Technical Articles

Case studies

The KGP Series delivers high capacitance, low ESR/ESL, and durable metal lead frames for miniaturised, sustainable, and high-frequency industrial, energy, and downhole applications.

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.

By combining 12-disk stacking with MAMR innovation, Toshiba aims to target 40TB-class 3.5-inch hard drives by 2027, thereby enhancing density, durability, and efficiency for next-generation data centres.

Yamaha Robotics SMT Section has introduced enhanced software tools to accelerate new product introduction (NPI) using YSUP-PG, the program generator for the company’s surface-mounters and inspection systems.

The GB10 Superchip co-designed by MediaTek delivers 1 PFLOP of AI performance to the NVIDIA DGX Spark desktop AI supercomputer for accelerating large AI model work.

TDK-Lambda's MU6 modular power supply offers up to 1500W with extremely low acoustic noise and BF-ready medical isolation, all within a compact footprint.

Showcased at OCP Global Summit 2025, the Helios platform supports gigawatt-scale AI data centers with open, liquid-cooled, double-wide racks.

Fraunhofer IPMS unveils a new EdgeVision Microdisplay technology improving efficiency and quality in high-resolution microdisplay production, with results showcased at the SID-MEC Conference, from November 3 to 4, 2025, in Göttingen.

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

Solution leverages ST power chip portfolio by combining silicon carbide (SiC), gallium nitride (GaN),and silicon technologies with advanced custom design at both chip and package levels.

International

SAMWHA’s YT series offers low ESR, high ripple resistance, and AEC-Q200 qualification, ensuring reliable performance up to +150 °C for automotive and industrial electronics.