NeoCortec's CEO will present on NeoMesh on LoRa, a technology that combines true mesh networking with LoRa's long-range capabilities to enhance reliability and power efficiency.
First to adopt High-K Epoxy Molding Compound, SK hynix enhances mobile DRAM with 3.5 times higher thermal conductivity and 47% lower thermal resistance, addressing heat challenges from on-device AI workloads.
Microchip's new GNSS Disciplined Oscillator Modules make it simple to integrate Position, Navigation and Timing (PNT) technology into a wide range of applications.
Toshiba and SICC have signed an MOU to improve the quality and characteristics of SiC power semiconductor wafers, ensuring a stable supply for the growing demand in AI data centers.
New MCU family complies with CNSA 2.0 and PSA Level 3, enabling secure motor control and power conversion applications while easing the industry’s transition to the PQC era.
Keysight’s solution supports 8K/12K video, HDR, and high-speed HDMI, offering automated compliance, diagnostics, and certification readiness for transmitters and cables.