05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Intel News

Intel Xeon 6 to Prove Foundational to Network Infrastructure at MWC 2025

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Telit News

Telit Cinterion Launches AI-Powered 5G Modules & Data Cards with Qualcomm’s Cutting-Edge Modem

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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TDK News

TDK adds full telemetry to new DC-DC converter modules for high power-density applications

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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MIkroe News

MIKROE Unveils LTE IoT 10 Click Board for Global LTE-M and NB-IoT Solutions

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Tria Technologies News

Tria will launch five new product families powered by Qualcomm at Embedded World

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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IDS Imaging Development Systems GmbH

IDS Unveils uEye EVS: High-Speed Industrial Camera Powered by Prophesee Event-Based Vision

New uEye EVS camera integrates the Prophesee-Sony IMX636 sensor, enabling ultra-fast, efficient machine vision with event-based sensing.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Critical Manufacturing

Critical Manufacturing to demonstrate how MES can deliver measurable, transformative outcomes

Critical Manufacturing will once again be present at Hannover Messe to show how its products can Make Industry 4.0 a Reality for all manufacturers of discrete products.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Keysight technologies News

Keysight and Ericsson Collaborate to Establish Pre-6G Test Setup Using Centimeter Wave Spectrum

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Delta Electronics

Delta Introduces the DTDM Series: High-Precision Modular Temperature Controllers for Demanding Applications

Delta launches DTDM Series of High-Precision Modular Temperature Controllers, designed for semiconductor industry and offering unparalleled precision and energy efficiency.

Read more…

05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Phytec News

PHYTEC Unveils the World’s First System on Module Featuring AM62Lx Processor

PHYTEC introduces the world’s first System on Module (SOM) for the new AM62Lx Arm^®-based processor from Texas Instruments (TI).

Read more…

Case studies

IDS: A deep look into the eye

White Paper

Parallel Operation of Power Supplies with User Systems

Intel Xeon 6 to Prove Foundational to Network Infrastructure at MWC 2025

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

Telit Cinterion Launches AI-Powered 5G Modules & Data Cards with Qualcomm’s Cutting-Edge Modem

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

TDK adds full telemetry to new DC-DC converter modules for high power-density applications

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

MIKROE Unveils LTE IoT 10 Click Board for Global LTE-M and NB-IoT Solutions

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Tria will launch five new product families powered by Qualcomm at Embedded World

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

IDS Unveils uEye EVS: High-Speed Industrial Camera Powered by Prophesee Event-Based Vision

New uEye EVS camera integrates the Prophesee-Sony IMX636 sensor, enabling ultra-fast, efficient machine vision with event-based sensing.

Critical Manufacturing to demonstrate how MES can deliver measurable, transformative outcomes

Critical Manufacturing will once again be present at Hannover Messe to show how its products can Make Industry 4.0 a Reality for all manufacturers of discrete products.

Keysight and Ericsson Collaborate to Establish Pre-6G Test Setup Using Centimeter Wave Spectrum

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

Delta Introduces the DTDM Series: High-Precision Modular Temperature Controllers for Demanding Applications

Delta launches DTDM Series of High-Precision Modular Temperature Controllers, designed for semiconductor industry and offering unparalleled precision and energy efficiency.

PHYTEC Unveils the World’s First System on Module Featuring AM62Lx Processor

PHYTEC introduces the world’s first System on Module (SOM) for the new AM62Lx Arm^®-based processor from Texas Instruments (TI).

International

Case studies

White Paper

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon® platforms at its Embedded World debut.

New uEye EVS camera integrates the Prophesee-Sony IMX636 sensor, enabling ultra-fast, efficient machine vision with event-based sensing.

Critical Manufacturing will once again be present at Hannover Messe to show how its products can Make Industry 4.0 a Reality for all manufacturers of discrete products.

The testbed establishes a cmWave communication link between an Ericsson pre-6G base station and test user equipment (UE) from Keysight.

Delta launches DTDM Series of High-Precision Modular Temperature Controllers, designed for semiconductor industry and offering unparalleled precision and energy efficiency.

PHYTEC introduces the world’s first System on Module (SOM) for the new AM62Lx Arm®-based processor from Texas Instruments (TI).

International

Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon^® platforms at its Embedded World debut.

PHYTEC introduces the world’s first System on Module (SOM) for the new AM62Lx Arm^®-based processor from Texas Instruments (TI).