14 {{ "2025-06-14T00:00:00+00:00" | date "MMM" }} '25

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Würth Elektronik News

Nano SIM and SD card connectors from Würth Elektronik

Würth Elektronik expands its portfolio with four durable Nano-SIM and microSD card holders in the smallest form factors, featuring high-quality design and partially gold-plated contacts.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

Micron News

Micron HBM Designed into Leading AMD AI Platform

Micron’s HBM3E 36GB boosts AMD Instinct MI350 GPUs with high bandwidth, low power use, and scalability for AI, HPC, and large model training.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS develops energy-efficient solution for real-time data transmission

Fraunhofer IPMS develops energy-efficient TSN testbed using Li-Fi, enabling real-time wireless data for mobile industrial automation applications.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

AMD News

AMD reveals open AI ecosystem with new silicon, software, & systems at Advancing AI 2025

AMD powers full-spectrum AI with top GPUs, CPUs, networking, and open software, backed by key partners like Meta and Microsoft.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik offers RECOM R-78K-0.5: efficient LDO replacement

Rutronik introduces RECOM's R-78K-0.5 series: compact, efficient DC/DC regulators with up to 96% efficiency, wide input range, no heat sink, and LDO replacement.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata introduces a resin-molded thermistor with wire-bonding

Murata Manufacturing launched the FTI Series NTC thermistor, the first to achieve resin-molded design and wire-bonding compatibility, catering to automotive thermal management needs.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.

Read more…

13 {{ "2025-06-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-13T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

Diodes Incorporated’s 64GT/s PAM4 Linear ReDriver enhances PCIe 6.0 signal quality

Diodes Incorporated introduces the PI3EQX64904, the industry’s first ReDriver reaching PCIe 6.0 speeds (up to 64 GT/s) while being backwards-compatible with PCIe 5.0/4.0/3.0 protocols.

Read more…

12 {{ "2025-06-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-12T00:00:00+00:00" | date "longDate" }}

Sabic News

SABIC showcases thermoplastics for high-voltage electrical application challenges

At PCIM Europe 2025, SABIC highlights ELCRES HTV150 film test results and advanced materials for various high-voltage electrical systems.

Read more…

12 {{ "2025-06-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-12T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Launches Compact Digital Audio Amplifiers for Smarter Automotive Cockpits

New HFDA80D and HFDA90D deliver 4x27W output with high efficiency, reduced component count, and native CISPR25 compliance.

Read more…

Case studies

Low-Power Congatec SMARC Modules for Powerful AI Inference

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Nano SIM and SD card connectors from Würth Elektronik

Würth Elektronik expands its portfolio with four durable Nano-SIM and microSD card holders in the smallest form factors, featuring high-quality design and partially gold-plated contacts.

Micron HBM Designed into Leading AMD AI Platform

Micron’s HBM3E 36GB boosts AMD Instinct MI350 GPUs with high bandwidth, low power use, and scalability for AI, HPC, and large model training.

Fraunhofer IPMS develops energy-efficient solution for real-time data transmission

Fraunhofer IPMS develops energy-efficient TSN testbed using Li-Fi, enabling real-time wireless data for mobile industrial automation applications.

AMD reveals open AI ecosystem with new silicon, software, & systems at Advancing AI 2025

AMD powers full-spectrum AI with top GPUs, CPUs, networking, and open software, backed by key partners like Meta and Microsoft.

Rutronik offers RECOM R-78K-0.5: efficient LDO replacement

Rutronik introduces RECOM's R-78K-0.5 series: compact, efficient DC/DC regulators with up to 96% efficiency, wide input range, no heat sink, and LDO replacement.

Murata introduces a resin-molded thermistor with wire-bonding

Murata Manufacturing launched the FTI Series NTC thermistor, the first to achieve resin-molded design and wire-bonding compatibility, catering to automotive thermal management needs.

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.

Diodes Incorporated’s 64GT/s PAM4 Linear ReDriver enhances PCIe 6.0 signal quality

Diodes Incorporated introduces the PI3EQX64904, the industry’s first ReDriver reaching PCIe 6.0 speeds (up to 64 GT/s) while being backwards-compatible with PCIe 5.0/4.0/3.0 protocols.

SABIC showcases thermoplastics for high-voltage electrical application challenges

At PCIM Europe 2025, SABIC highlights ELCRES HTV150 film test results and advanced materials for various high-voltage electrical systems.

STMicroelectronics Launches Compact Digital Audio Amplifiers for Smarter Automotive Cockpits

New HFDA80D and HFDA90D deliver 4x27W output with high efficiency, reduced component count, and native CISPR25 compliance.

International